Raytheon Awarded $5.5 million Contract to Develop HEALICS Technology

TEWKSBURY, Mass., Oct. 12, 2009 -- The Defense Advanced Research Projects Agency has awarded Raytheon Company (NYSE: RTN) a $5.5 million contract to design, fabricate and test Self-HEALing mixed-signal Integrated Circuits (HEALICS) technology. If all contract phases are completed, the value of the contract could reach $11 million.

Raytheon's HEALICS effort incorporates self-healing into a complex system-on-chip (SoC) design, providing the capability for the chip to sense undesired circuit behaviors and correct them automatically. This maximizes the yield of increasingly complex mixed-signal SoC's on an individual wafer to meet demanding performance specifications in the presence of extreme process variations and environment conditions.

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"The Raytheon approach breaks through the limitations of the current application-specific approaches and provides an efficient, general solution for self-healing," said Michael Del Checcolo, vice president of Engineering for Raytheon Integrated Defense Systems. "This solution can be integrated into a wide variety of mixed-signal circuit designs leading to significant increases in yield-to-performance, resulting in increased functionality and lower cost for a broad range of military applications."

Using its OpenAIR™ business model for assembling talent and capabilities, Raytheon is partnering with the California Institute of Technology, Pasadena, Calif.; and North Carolina State University, Raleigh, N.C., to bring a unique and complimentary set of skills, experience and expertise to this program.

Integrated Defense Systems is Raytheon's leader in Global Capabilities Integration providing affordable, integrated solutions to a broad international and domestic customer base, including the U.S. Missile Defense Agency, the U.S. Armed Forces and the Department of Homeland Security.

Source: Raytheon Company